Thermal and handheld OEM · 2026-11-01
LRF module for thermal scope OEM selection
For a thermal-scope or handheld OEM, choose the laser rangefinder module after the optical axis, eye box, housing and host protocol are defined—not before.
Selection sequence
- Define the measurement job: target size, working distance, minimum distance and expected motion.
- Choose the wavelength and emitter/receiver geometry that fit the thermal optical path.
- Reserve the electrical interface, supply rail, startup current and frame parser.
- Check mass, dimensions, mounting, heat path and lens clearance against the complete enclosure.
- Qualify the assembled product under the target reflectance and ambient-light conditions.
Model table
| Model | Wavelength | Published range / condition | Interface | Weight |
|---|---|---|---|---|
| LR1000E2 | 905 ± 5 nm | 4–1,000 m | UART-TTL, 115200 bps | ≤10 g |
| LR2000E2 | 905 ± 5 nm | 4–2,000 m | UART-TTL, 115200 bps | Confirm current drawing |
| LRF0305C | 1535 ± 5 nm | ≥4,000 m at 60% reflectivity; other target conditions are separately stated | UART-TTL, 3.3 V | ≤14 ± 1 g (as printed) |
| LRF1831C | 1535 ± 5 nm | ≥6,500 m to 5 m × 15 m; ≥12,000 m to 20 m × 20 m, stated conditions | RS-422 | ≤410 g |
Thermal and handheld fit checks
Leave clearance for the receiver aperture and the thermal optical path; verify bore-sight and parallax at the actual mounting angle; and test the host parser during startup, retries and no-return frames. A module page is a starting point for an OEM review, not a finished thermal sight certification.
FAQ
Should the rangefinder sit inside the thermal optical path?
That depends on the optical and mechanical design. Confirm aperture, bore-sight, parallax, enclosure clearance and the complete assembled configuration.
Which interface is easiest for an OEM?
UART-TTL is the most common published interface in the compact 905 nm records; larger 1535 nm records may publish RS-422. Confirm voltage and frame format before wiring.
Related model records
Open the exact model page for current specifications, conditions and integration documents.